Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Jason P
> 3 dayWhat Im saying is that its not crap.
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gazza
> 3 dayPrompt service, very good product.
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nanashi
> 3 dayThis paste cannot really be used for bare die. Picture shows applied to ps4 apu after a few months. The oil had separated from the filler and the paste loses effectiveness. When applied to the cpu of a laptop computer the temperature was measured to increase within 24 hours.
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jose martin Carrillo
> 3 dayIncreible ya le hacia falta un cambio de pasta a mi procesador y aproveche para utilizarla en mi tarjeta de video las temperaturas estan dentro de lo ideal t.video(31 en frio y 73 max en juuego) y el procesador no pasa dee los 60 grados
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yvonnne reeser
01-11-2024thank you
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Joel Parker
> 3 dayI like this thermal paste. I used it to replace some older thermal paste and my Temps are low again. Noctua makes quality products and this is one of them.
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Selvaraj
> 3 dayIt certainly improved the cooling performance of ASUS notebook
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Shaderclouse
> 3 dayRealmente me ha sorprendido el pedido llego a tiempo y en perfecto estado, he notado la diferencia bastante con esta pasta termica,
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Luc Lanois
> 3 daypat pour dissiper la chaleur entre le processeur et le radiateur a renouveler tous les 2 à 3 ans
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Mykaël
Greater than one weekThat thermal paste does its job. It keeps a nice contact between the cpu and the cooler. Easy to apply too which is a big plus.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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