Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Coleman Skiles
15-11-2024Great for ps4
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Lindsay Houghton
> 3 dayBought this for a new build. Have seen other products that need done every 8 months. Have used on i3-12100 and re-pasted a ROG strix 1070 both have kept within thermal limits. Have not experienced thermal throttling even when using folding@home. In Picture is after re-pasting GPU running rocket league.
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Lucas Dittrich
> 3 dayPossuo um Ryzen 7 3700x rodando a 4.4Ghz, Air Cooler Gammax 400v2,16Gb Ram Corsair PRO 3400mhz, Asrock B550m, RTX 3060 12Gb, RAID0 de nvme, processador não passa de 59 graus. Excelente, entrega rápida pra Curitiba.
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Harixzon
Greater than one weekThe item was distinctive! Ever so prime delivery. Very, very charming packaging.
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francois.P
> 3 daysans être un expert en patte thermique, jai toujour acheté de la noctua (je la change tout les deux ans sur proc et carte graphique) et jamais eu de problème de chauffe.
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Jeremy
> 3 dayUtiliser pour remplacer sur ma ps4 qui turbinait.
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Dwig A. Morales Aldana
> 3 dayThis thermal coumpound is viscous, and offers great performance for the cpu temp. At idle my temp is 36 °C without overclock, and with overclock this temp reach 40 °C. At full load (overclocked), the cpu temp is 54 °C. My CPU is AMD Phenom II X4 965 overclocked at 3.8 GHz.
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Steven T.
> 3 daygreat for CPU cooling, spreads easy too
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salvo
> 3 dayil top
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Manitou
> 3 dayEfficacité Noctua
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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