Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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chollier christian
> 3 dayJétais fidèle à Siver Artic 5 pour sa pâte thermoconductrice ...
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Manuel
> 3 dayObjetivo conseguido con su compra. Temperaturas bajas en el cpu. Comparada con la pasta térmica que venia con el procesador... La noche y el día.
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Daniel Wrona Jr
> 3 dayWorks as intended, my cpu is more happy with this thermal paste.
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Toez
> 3 daySeems to work great paired with DH14. I am using the pair in my i7-4930k rig. Idle temps are around 26C with 100% load via prime95 topping out around 60C. I wanted something that would work well with no curing time and is not conductive, looks like this is the one.
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Erl
> 3 daySehr gutes Produkt in verschiedenen Wärmestufen. Läßt sich leicht auftragen verteilen und bleibt sogar haften gegenüber anderen Produkten. Wärmeleitfähigkeit erhöhte sich gegenüber anderen um 5-8%.
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Rob Alexander
> 3 dayThis paste is all you need for your new build. The tube is big and will last you forever...and ever.
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Lauriane
> 3 daySuper, cétait un cadeau pour mon frère (pour son PC) et il en est ravi !
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le petit pois féroce
> 3 dayL’embout noir est un bouchon quil faut dévisser avant utilisation. Alors ça aurait été mieux quil ait justement une forme de bouchon pour quon comprenne tout de suite.
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Connor Rogers
> 3 dayWorks
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sautour
> 3 daytres bon rapport qualité / prix bonne conduction pas de problème et facile a étaler a conseiller sans soucis RAS
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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