Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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ussbarman
> 3 daysuper product, shipping very fast
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fortin claudia
> 3 dayAcheter pour remplacer celle de ma ps4 ! Fonctionne parfaitement bien
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fernando alvarez
> 3 dayI Like it
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FishHuntNW
> 3 dayDid some work on my Alienware R9 and had to remove the AIO. My before idle temps were about 40 degrees C with the factory paste. My idle temps now are about 34 degrees C. Great product made by a company built on keeping CPU/GPU cool.
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Deligne Rebecca
> 3 dayNickel
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Miguel
> 3 dayPut it on my GPU and CPU and got about a 4° Celsius difference, works great.
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Matthew Canale
> 3 dayArrived much quicker than expected. Temps on cpu are great.
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MURRAY©
> 3 dayPâte thermique non utilisée mais recommandée sans hésitation par un proche de mon entourage dont jai entièrement confiance.
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Sylvain G.
> 3 dayTrès bonne pâte thermique, facile à utiliser, mise en application simplissime. Il faut juste être attentif à la dose que lon appose sur le processeur, il en faut très peu. Très bon article !
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Martin
> 3 dayWas soll man sagen die Wärmeleitpaste, ist ok ! Die paste von anderen herstellern ist genauso . Sie lässt sich besser verarbeiten ok und dosieren das wars aber auch schon. Die Wärmeleitfähigkeit ist mittelmäßig da gibt es sicherlich andere die besser sind ! Bekommt ein ryzen 7 3800x oc im idle auf 45grad , was mit der anderen paste (name nenne ich nicht ) besser war .
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
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